board-to-board connector / low-profile / SMT / press-fit

Z-Ray® micro array interposers are ultra-low profile, high density, highly customizable solutions for board-to-board, IC-to-board, and cable-to-board applications.BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low profile FR4 substrate under high pressure and temperature.
Low Profile

Low profile 1 mm body height
Custom body height as low as 0.50 mm
High performance to 28+ Gbps
One piece design