plasma cleaning machine / automatic / manual / for the electronics industry

Large chamber tabletop plasma cleaner for R&D, low to mid volume production.
The only difference between Tergeo-plus and Tergeo plasma cleaner is the size of the sample chamber. The inner diameter of the sample chamber has been increased from 110mm in Tergeo to 160mm in Tergeo-plus. The depth of the sample chamber is the same, e.g. 280mm.

Application of Tergeo-plus plasma cleaner is similar as the standard Tergeo plasma cleaner, except that it can accommodate larger samples. Here are list of typical applications:
Photoresist ashing, descum and silicon wafer cleaning
PDMS, microfluidics, glass slides and lab-on-a-chip
SEM/TEM sample cleaning for hydrocarbon contamination removal
Medical device activation, sterilization and improve coating adhesion
Wire bonding, flip chip underfill, device encapsulation and decapsulation
Improve bonding for metal to metal or composite
Improve bonding for plastic, polymer and composite materials

Features:

Large sample chamber (ID:160mm, L280mm). Enough to accommodate a 4-inch wafer boat and one 6-inch wafer.
Cleaning modes: Immersion plasma cleaning for high speed etching and surface modification; remote plasma cleaning for gentle surface contamination removal, such as SEM/TEM sample cleaning; pulsed operation to generate plasma with average rf power less than 0.5watt for extremely delicate samples.
Operation methods: Automatic recipe execution; automatic job sequence execution; manual operation.