reflow soldering machine / for PCB

Description

SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging.
SMTmax F6 systems provide optimized lead-free processing for the ultimate in productivity and efficiency. F6 reflow oven exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, adding up to the most economical LED aluminum circuit board soldering in the industry. F6 reflow oven is top 6, bottom 6 heating zones and 400 degreeC maximum temperature and equipped with fully convection.
The system comes with computer control and touch screen simplified user interface and incredibly self calibration capabilities.