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Function:
thermal conductor
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Material:
oxime, RTV silicone
TCORP is a single component, 100% solids, low odour silicone RTV which cures upon exposure to atmospheric
moisture. It has been designed to fill the gap between device and heat sink, thus reducing the thermal
resistance. It can be applied around components and power resistors to dissipate excess heat to heat sinks,
avoiding any potential overheating and subsequent failures. It can also be used as a low bond strength
adhesive, sealant or gasketing compound.
• Excellent thermal conductivity; combines adhesive properties with efficiency of heat dissipation
• Medium bond strength; combines good adhesion with thermal dissipation
• Very wide operating temperature range; combines properties required for the automotive market
• Sing