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  1. Home
  2. Electricity - Electronics - Optics
  3. Electronic Components
  4. Sockets and microelectronic packages

Sockets and microelectronic packages

Electronic Components
Resistors
Capacitors
Inductors, coils
Transformers for electronics and telecom
Potentiometers, variable impedances
Acoustic transducers
EMI shielding
Quartz oscillators
VCO oscillators, SAW oscillators, other oscillators...
EMI filters
Electronic filters
Resonators
Attenuators, phase shifters, delay lines...
RF connection components
Clock generators, frequency synthesizers
Schottky diodes, Zener diodes...
Bipolar transistors, MOSFETs, IGBTs...
Thyristors, TRIACs
Diodes modules, diode arrays
Transistor modules, transistor arrays
Thyristor and TRIAC modules, thyristor and TRIAC arrays
MOSFET, IGBT and TRIAC module drivers
Miniature relays for electronics, analog switches
Miniature switches and micro-switches for electronics
Thermionic vacuum tubes, cathode-ray tubes
Touchscreens
Integrated circuits: random access memory (RAM)
Integrated circuits: read only memory (ROM)
Flash memory chips
Integrated circuits: clock modules, timers
Processors and Controllers (MPUs, MCUs, DSPs)
Amplifier ICs
Codec ICs
RF integrated circuits
Signal processing ICs
Analog / digital converter ICs
Peripheral line drivers, Bus controllers, Network controllers
Amplifier modules
Power management
Logic gates, FPGAs, ASICs
Application-specific Standard Products (ASSPs)
Analog electronics boards and systems
Ferrite cores
Transformer cores
Fans for electronics
Heatsinks
Printed circuit boards
Sockets and microelectronic packages
Inks, adhesives and varnishes for printed circuit boards
Anti-static conductive PCB holders
Hardware tools for electronics development
Ceramic filters
  • epoxy seal lid for encapsulation packages

    epoxy seal lid for encapsulation packages

    Master Bond
  • PoP test socket

    PoP test socket

    Smiths Connectors
    - Memory-bearing, memory-less and manual test solutions - Advanced alignment features for both top and bottom devices - Refined analysis tools ensuring production ready solutions - Controlled impedance for maximum signal integrity - ...
  • test socket

    test socket

    DaVinci
    Smiths Connectors
    - High speed > 40 GHz / 20 Gbps - Outstanding thermal properties - Extreme rigidity, superior durability - Developed for > 0.8 mm pitch - Patented technology Smiths Connectors’ DaVinci sockets for high speed test offer a revolutionary ...
  • QFN test socket

    QFN test socket

    Celsius
    Smiths Connectors
    - Resistance 10 GHz @ -1dB - Temperature rated: -50°C - 175°C - Minimal cleaning required - Patented technology - Suited for tri-temp testing Smiths Connectors’ Celsius contact takes advantage of a slightly longer signal path ...
  • WLCSP test socket

    WLCSP test socket

    Monet
    Smiths Connectors
    - Ideal for pitches > 200 µm - Superior signal integrity - Short signal path < 3 mm - Stable C-res over 750K cycles - High degree of parallelism - Patented technology Monet offers all of the conventional advantages of spring probe ...
  • QFN test socket / manual

    QFN test socket / manual

    Monet
    3M Electronics
    3M™ Textool™ Open-Top Sockets for QFN applications features an open-top design with 0.4 mm pitches accommodation. It is designed for vertical actuation. It is compatible with most robotic handlers, eases manual operation, and eliminates ...
  • SMT integrated circuit mount / socket

    SMT integrated circuit mount / socket

    ProFlow® tx
    DEK Printing Machines
    ProFlow Evolution Tx is one of the latest enclosed print head solutions in the ProFlow DirEKt Imaging product range from DEK. This system is ideally suited for low viscosity material applications including SMT glue printing via Pumprint ...
  • socket terminal carrier sheet / flexible / polyamide

    socket terminal carrier sheet / flexible / polyamide

    ProFlow® tx
    Advanced Interconnections
    Replaces hand-loading operations Enables complete solder joint inspection Easily customized with multiple terminal styles Download a Peel-A-Way Removable Terminal Carrier overview data sheet Visit our Peel-A-Way Board to Board Connectors ...
  • pin grid array (PGA)

    pin grid array (PGA)

    NP89 series
    Yamaichi Electronics
    Pin Grid Array with various grid sizes Wiping action system: Cleans up IC lead surface during handling action Reliable 3 point contact system Cost performance: Different contact thickness for contact area and terminal area Depopulated ...
  • Kelvin test socket

    Kelvin test socket

    2.8 A, max. 34.7 GHz | Pad ROL™200KR series
    Johnstech
    This item is known for providing ultimate performance and being delivered in a design that is configurable and highly flexible. The Pad ROL 200 KR by Jonstech is also known for its versatility when it comes to leaded devices. The items ...
  • hybrid package

    hybrid package

    2.8 - 4 A, max. 20 GHz | Pad ROL™200 series
    Optispac, Inc
    OptiSpac provides customized hermetic packages that are based on glass metal seals. With diverse packaging made of stainless steel, kovar along with other types of materials that are readily available in shapes such as rectangles, butterflies, ...
  • axial shaft test socket

    axial shaft test socket

    ø 0.015 - 0.04 in, 700 V, 3 A | ADU02DXTB
    Sullins
    The Axial Test Socket for Diodes is built with a size of .015" to .040" lead diameters. It has a contact and insulator material of beryllium copper and black PPS. It can work with a temperature ranging from -65 °C TO +150 °C and has processing ...
  • PTFE-coated test socket

    PTFE-coated test socket

    LED-81x series
    LMP-fluorcarbon
    Material specifications Shaped pieces: St 35 according to DIN 1629 Part 3 (1.0308) Flange: R-St 37-2 according to DIN 17100 (1.0112) Coating: PTFE according to ASTM D 1457-78 Type IV and V Technical delivery conditions: according to DIN 2874
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