PECVD deposition machine / PVD

Most important Features:

Combined PVD & PECVD process - to deposit very smooth coatings

Special Si containing gas line - controlled by additional Mass Flow Controller

Silicon increases heat resistance
Silicon decreases internal stress of the coating
Silicon improves adhesion -> thick DLC coatings are possible
BIAS supply 350 kHz - to enable deposition of non-conductive layers.

Special heaters with dust filter

grids in front of the heaters
to avoid contamination of the substrates by dust released from the heaters
VIRTUAL SHUTTER® to clean the target to the back before deposition.

Mechanical TUBE SHUTTERS® to protect targets

against contamination by acetylene
against being coated when idle